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Cross-Border Integration ·· Connecting Hearts and Chips | KFMI Shines at SEMICON CHINA 2023
2024-07-01浏览量:557

From June 29th to July 1st, the grand semiconductor industry event SEMICON CHINA 2023, themed "Cross-Border Integration, Connecting Hearts and Chips," was held at the Shanghai New International Expo Center. This event covered the entire semiconductor industry chain, including chip design, manufacturing, assembly and test, equipment, materials, photovoltaic, and displays. Aimed to provide the industry with opportunities to understand global industry patterns, cutting-edge technologies, and market trends, promoting R&D innovation and sustainable industry development. KFMI, as a core enterprise in integrated circuit materials, showcased a variety of products, including ultra-high purity sputtering targets for integrated circuits, targets for flat-panel displays and solar cells, semiconductor core components, and copper-clad ceramic substrates. The 108 square meters booth featured nearly 100 products, including 12-inch advanced process targets and coils, a flat-panel display target approximately 4 meters long, and components with 13,000 densely packed tiny holes. KFMI’s high-technology, original, and unique design concepts, along with its superior performance and high-quality products, attracted many attendees, garnering significant attention from industry professionals.


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KFMI Booth Site


Industry visitors from around the world gathered at KFMI’s booth to comprehensively understand the company's industrial layout and cutting-edge products. In addition to ultra-high purity sputtering targets, copper-clad ceramic substrates in the third-generation semiconductor packaging and testing field attracted numerous inquiries from industry professionals.


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On-site Explanation by Staff


The continuous stream of visitors kept KFMI’s team engaged, but they remained enthusiastic, patiently listening to questions, explaining products in detail, and providing meticulous, professional answers.


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Work Scenario at the Booth

 


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KFMI Booth Site


On the morning of the 29th, the Advanced Materials Forum (AMF) was held at the Jumeirah Himalayas Hotel Shanghai. Dr. Lijun Yao, Chairman and Chief Technology Officer of KFMI, delivered a speech titled "Breaking Through Core Technologies to Build Core Competitiveness and Provide Certainty for the Global Industry Chain," sharing new progress in the industrialization of ultra-high purity materials and sputtering targets in China. As a leading global supplier in the target market, KFMI has developed a full set of domestically produced equipment and processes, possessing complete independent intellectual property rights and leading international technical levels. Based on the small-batch, multi-variety characteristics of target materials, it has built a smart factory and established nationwide production service bases.


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Dr. Yao Lijun Delivered a Speech at AMF


In an era where chips are omnipresent and indispensable, KFMI continues to innovate technologically, proactively laying out key materials for third-generation semiconductors. It has completed the construction of the first domestically designed third-generation semiconductor power device module core material production line with world-class standards and plans to build a large-scale domestic production base for copper-clad ceramic substrates with independent intellectual property rights, advanced process technology, comprehensive material specifications, and automated production lines. Awaiting the warm spring after the cold wave, KFMI will continue to adhere to specialization, internationalization, and localization, always taking "industrial contribution to the country and strengthening the nation through industry" as its mission. With the goal of "realizing the great rejuvenation of the Chinese nation," it will continue to delve deeply into the semiconductor industry, leading the company to forge ahead innovatively and contribute to creating a better "China Chip"!·


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